ODM 100G DAC Cable Solutions

High-Density, Low-Latency Copper Interconnect Technology for Next-Generation Data Center Architectures and Enterprise Cloud Networking Infrastructure.

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The Science of 100G Direct Attach Copper (DAC) Cables

In modern high-density networking, the ODM 100g Dac Cable serves as the bedrock of physical layer infrastructure. Designed to transmit massive quantities of data over short distances, these high-speed twinaxial copper cables offer an optimal cost-to-performance ratio. Direct Attach Copper assemblies eliminate the need for optical conversion, resulting in near-zero latency, negligible power dissipation, and lowered maintenance costs. By utilizing SFF-8665 compliant QSFP28 connectors and high-precision physical-medium-dependent (PMD) copper sub-assemblies, our ODM designs ensure robust signal integrity up to 5 meters, supporting crucial standards including IEEE 802.3bj (100GBASE-CR4) and Infiniband EDR.

From a hardware engineering perspective, the performance of a 100G DAC cable is heavily determined by the attenuation characteristics of the copper medium, which is directly linked to the American Wire Gauge (AWG) thickness. Typically available in 30AWG, 28AWG, and 26AWG, each physical gauge size represents a trade-off between bend radius flexibility and maximum link distance. The electrical interfaces rely on four independent, differential transmit and receive channels, with each lane operating at up to 25.78125 Gbps. Through high-frequency design optimization and sophisticated manufacturing techniques, we manage signal insertion loss, return loss, and crosstalk (both NEXT and FEXT) to exceed strict Multi-Source Agreement (MSA) specifications.

Excellent Signal Integrity

Features optimized printed circuit board (PCB) layouts within the backshell to minimize impedance mismatch, keeping differential return loss below industry limits.

Negligible Power Footprint

Requires zero operational power from the host port, significantly reducing cooling overhead and overall data center PUE (Power Usage Effectiveness).

Standardized Interoperability

Fully compliant with the QSFP28 MSA, enabling seamless drop-in deployment with hardware from Cisco, Arista, Juniper, Dell, and other major vendors.

Over a Decade of Engineering & Manufacturing Leadership

Established in 2012 in Hong Kong as a high-tech communication enterprise, Kocent Optec Limited has grown to become one of China's premier fiber optic and high-speed copper termination product manufacturers and solution providers. We are dedicated to research, development, and manufacturing of passive and active fiber optic communication products, transceivers, and copper cabling assemblies designed for modern telecommunication networks, enterprise structures, and large-scale data centers.

By leveraging our extensive engineering experience and deep production capacity developed over the years, we focus on maximizing performance outcomes for our valued partners worldwide. This collaborative approach enhances our customers' core competencies, enabling them to outperform competitors and adapt to accelerating bandwidth demands. We view ourselves not just as a manufacturer, but as your trusted engineering partner in connectivity solutions.

With over 13 years of specialized manufacturing experience, we strictly enforce global industry standards. Using mature, data-driven scientific methods, we ensure that 100% of our products undergo rigorous testing and inspection protocols before dispatch. This attention to detail guarantees that every cable assembly, transceiver module, and optical adapter is optimized for long-term operational reliability.

Kocent Optec Production Facility
13+
Years of Experience
100%
Inspected & Tested
50+
Countries Served
20+
Tier-1 Telco Clients

Years of sales, engineering design, and logistics coordination have enabled us to build partnerships across diverse global regions. Today, our footprint spans East Asia, Southeast Asia, the Middle East, Eastern Europe, Western Europe, Northern Europe, South America, North America, North Africa, and South Africa.

Win-win cooperation is our constant goal. Many of our OEM and ODM products have successfully won telecommunication operator tenders and continue to perform in demanding, carrier-grade network topologies.

Quality Inspection Center

Trusted Partner of Global Telecom Operators

Our commitment to compliance, engineering precision, and robust production scalability has qualified us as a regular product provider for international telecommunications tenders. Kocent Optec's infrastructure components, transceivers, and copper cable designs are deployed within networks operated by major global telecom brands, including:

SingTel
Vodafone
America Movil
Telefonica
Bharti Airtel
Orange
Telenor
VimpelCom
TeliaSonera
Saudi Telecom
MTN
Viettel
Bitel
VNPT
Laos Telecom
MYTEL
Telkom
Telekom
Entel
FiberTel
StarFiber
Ooredoo
Beeline
Azercell

Macro-Industrial Landscape: The Transition to High-Density 100G Copper

The global demand for cloud storage, AI training pipelines, and high-frequency financial platforms has led to a major reconfiguration of physical network fabrics. As speeds migrate from legacy 10G and 40G interfaces to 100G and beyond, managing power usage and thermal envelopes within network racks has become critical. In environments where hundreds of servers sit in a single rack, the thermal profile of optical transceivers can quickly overwhelm facility cooling capacity. This is where ODM 100G DAC Cables provide a clear structural advantage.

Because passive DAC assemblies require no optical conversion, their power consumption is virtually zero. Scaling this across thousands of links in a multi-megawatt facility results in significant direct power savings and secondary cooling cost reductions. Additionally, from a CAPEX perspective, DAC cables avoid the cost of laser diodes, photodetectors, and complex internal DSPs, offering a highly economical method to interconnect Top-of-Rack (ToR) switches directly to host network interface cards (NICs).

By implementing a custom ODM process, Kocent Optec develops tailored solutions targeting specific layout configurations. For example, in hyper-converged computing clusters, specialized breakout configurations (such as QSFP28 to 4x SFP28 DAC) allow a single high-speed switch port to interface directly with up to four independent compute nodes. This optimizes port density and simplifies cable routing, improving airflow and lowering operational risk.

Furthermore, our manufacturing process incorporates premium materials, including silver-plated copper conductors and high-density polyethylene insulation. This ensures consistent differential impedance matching, minimizing high-frequency attenuation and jitter. These components are protected by low-smoke zero-halogen (LSZH) or PVC outer jackets, meeting relevant regional safety codes.

Production Process Standards

Technical Roadmap: Moving from 100G to 400G and 800G Architectures

As transmission standards shift, modern networks require high-frequency physical media that can support higher signaling rates. Traditional 100G architectures relied heavily on NRZ (Non-Return-to-Zero) modulation over four discrete 25 Gbps lanes. Modern 200G, 400G, and 800G designs, however, utilize PAM4 (Pulse Amplitude Modulation 4-Level) encoding, which packs twice as many bits into the same time interval. This transition introduces complex signal integrity requirements, as PAM4 is more sensitive to return loss and external electromagnetic interference.

To address this, Kocent Optec's ODM development cycle is actively engineering next-generation copper and active optical cable (AOC) solutions. By optimizing physical wire construction and incorporating active equalization chips directly into the connector shell, our active copper assemblies extend operational reach while maintaining compatibility with legacy ports. Our ongoing development focuses on:

Advanced Signal Processing Integration

Developing Active Copper Cables (ACC) featuring compact internal pre-emphasis and equalization ICs to extend 100G/200G link lengths up to 7-10 meters over thinner copper wire.

Higher Data Density (PAM4)

Providing high-precision backshell designs engineered for the tight tolerances of 56G and 112G SerDes interfaces, laying the groundwork for transition to 400G and 800G OSFP/QSFP-DD systems.

Advanced Thermal Performance

Improving standard metal shell components with integrated heatsink fins to enhance heat dissipation in high-density switch configurations, ensuring stable long-term performance.

Technical Q&A / FAQ

Expert technical insights regarding high-frequency design, compatibility configuration, and deployment of 100G copper cable assemblies.

What is the maximum link distance of a passive 100G DAC cable, and how does wire gauge affect it?
For passive 100G QSFP28 DAC assemblies, the standard maximum reach defined by MSA specifications is 5 meters. This limit is due to high-frequency attenuation at 12.89 GHz (the Nyquist frequency for 25.78 Gbps NRZ transmission). Physical distance capability is tied to the wire's gauge (AWG). 30AWG wire is thin and flexible but limited to about 1 to 2 meters. 28AWG covers up to 3 meters, and 26AWG is thicker and less flexible but can extend up to 5 meters while meeting signal-loss requirements.
How does Kocent Optec guarantee compatibility with switches from different network vendors?
To ensure wide interoperability, each ODM DAC cable's EEPROM is programmed with vendor-specific configuration files during production. This ensures that when the cable is plugged into a switch (such as Cisco, Arista, or Juniper), the host system correctly recognizes the transceiver type and credentials. This prevents port-blocking errors and allows for seamless integration into multi-vendor environments.
What is the difference between Passive and Active Direct Attach Copper cables?
Passive DAC cables contain no active electronic components; they provide a direct electrical connection between the host PCBs. This keeps them highly reliable, cost-effective, and low-power, though they are limited to short distances. Active DAC cables (either ACC or AEC) include internal pre-emphasis, amplification, or retimer ICs to clean up the electrical signal, allowing for longer lengths and thinner wire gauges at the cost of slight power consumption.
What testing procedures are used to verify high-frequency signal integrity?
Our quality control protocols require 100% inspection before shipment. We use high-end oscilloscopes and Vector Network Analyzers (VNA) to run bit error rate (BER) tests and verify eye diagrams. Key parameter measurements include differential insertion loss (SDD21), return loss (SDD11), near-end crosstalk (NEXT), far-end crosstalk (FEXT), and common-mode conversion, ensuring every cable meets or exceeds MSA specifications.

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